The unique MiniFoot pin design uses a “bow-tie” shaped foot that provides a stable foundation, while also promoting solder wicking for an optimal solder fillet concentrated around the base of the pin. The result is consistent pin-to-pad alignment and superior solder joint pull-strength.

MiniFoot pins are manufactured via a progressive stamping process, with each pin remaining attached to the continuous top-carrier material, and are supplied in reeled formats with up to 10,000 pins on a standard 15 inch reel. Standard MiniFoot pins are manufactured in high conductivity copper, with options for tin/lead to meet special requirements. The .025” square copper pin can conduct up to 19.5 amps whereas a typically used .040” power brass pin is rated at 14 amps. Replacing the power pin with the MiniFoot pin would reduce the mix of components in an assembly. A variety of pin lengths and custom features can also be accommodated with rapid turnaround development cycles and relatively low tooling costs.

Utilizing Autosplice’s AutoFeeder automation technology, the MiniFoot pins can be efficiently delivered via industry-standard pick-and-place equipment. The AutoFeeder mechanism automatically shears off each successive MiniFoot pin and holds it firmly upright in a “V” block for consistent presentation to the pick-up nozzle. Automatic self-replenishment at cycle speeds of less than 250ms ensures that pins are always available for picking, without requiring any external control from the placement machine. AutoFeeder technology is compatible with all leading pick-and-place equipment, including Fuji, Siemans, Sanyo, Philips, and Zevatech.