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 Lead free
Traditional production techniques of printed circuits use (or rather we should say "used") lead as their base element. After a number of International agreements both Japan and Europe have decided the elimination of lead from printed circuits boards, placing as their deadline for the completion of this process, 2001 and 2006 respectively.In order to reach this objective manufacturers have to focus on the problem of welding and commit themselves to introduce into products new solutions that conform to market requirements. Manufacturers who use lead free alloys are trying to improve production processes, also keeping in mind the increase in costs and the higher melting point of materials. In this new situation, the availability of solutions that offer X ray images will become a precious instrument to be used on the production line, to control the pre-assembly process, pin point good junctions and especially verify their structural integrity. Among the characteristics that become necessary the capacity to analyse on line the welding points in printed circuits, as well as checking the quality and making the necessary changes for recycling processes, which can vary from oven temperature adjustment, to the change in the distribution of welding paste. November.2001
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