Modular sensor containers

These solutions use DuPont’s Green Tape materials. For years, the Fraunhofer Institute for Reliability and Microintegration (Institut for Zuverlossigkeit und Mikrointegration -IZM) in cooperation with the Research Center for Technologies on Microsystems of the Technical University of Berlin (TUB) has started a common research program in the field of assembly technologies and interconnections in microelectronics.

The main direction of their activity concerns system integration and assembly, both on an integrated circuit level, and at the first level of integration. Among the most recent developments, the creation of a special modular ‘kit’ that allows the stacking of a series of microelectronic and micromechanical modules, that can connect sensor and actuator functions to create very complex integrated microsystems.